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137 Results for 'Semiconductors & Integrated Circuits'
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Technology
Degradable Neutral Layer for BCP Lithography
The lithographic process is one of the most powerful technologies of the digital electronics era. Lithography allows hundreds of millions of components to be fabricated on a single chip with pattern f...
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Padma Gopalan, Daniel Sweat, Jonathan Choi, Myungwoong Kim | P130174US01
Technology
Reusable Virtual Substrates for Growing Semiconductor Devices
‘Virtual substrates’ comprise an underlying growth substrate and one or more metamorphic buffer layers (MBLs) made of semiconductor alloy. The MBL is graded so that its lattice constant initially ...
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Thomas Kuech, Kevin Schulte, Luke Mawst, Tae Wan Kim, Brian Zutter | P130206US01
Technology
Patterned Graphene for Field Effect Transistors
Interest in graphene has surged due to its outstanding electrical properties. Graphene is a two-dimensional, carbon-based material with high tensile strength, stiffness, optical transparency and therm...
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Michael Arnold, Padma Gopalan, Nathaniel Safron, Myungwoong Kim, Jonathan Choi | P110242US01
Technology
Flexible Thin-Film Transistors Are Doped and Strained
Fast, flexible electronics operating at radio frequencies (greater than 1 GHz) are attractive because of their versatility, power savings and wide applicability. Uses include wireless and high-speed c...
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Zhenqiang Ma, Max Lagally, Jung-Hun Seo | P130145US01
Technology
Improved Block Copolymer Engineering for Directed Self-Assembly of Thin Films
Block copolymers (BCPs) are a class of polymers synthesized from two or more bonded units. Forming BCPs in bulk, and turning the material into thin film, can produce nanoscale structures useful to man...
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Paul Nealey, Frank Bates, Sangwon Kim | P110274US02
Technology
Smoother Waveguides for More Efficient Nonlinear Frequency Conversion
For many applications – from remote sensing to laser displays – it is necessary to convert the frequency of light via nonlinear interaction in semiconductor materials. Waveguide devices accomplish...
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Dan Botez, Thomas Kuech, Luke Mawst, Steven Ruder | P120326US01
Technology
Bottom-Up Patterning of Smooth Graphene Microstructures and Nanostructures
One of the strongest, lightest and most conductive materials known, graphene is an atom-thick carbon film with unrivaled high-tech potential. It is stronger than diamond but capable of bending like ru...
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Michael Arnold, Padma Gopalan, Nathaniel Safron, Myungwoong Kim | P110245US02
Technology
Semiconductor Interconnect Design for Small, Inexpensive, Integrated Current Sensing with Improved Reliability
Semiconductors, which regulate power flow in many modern electronic devices, use interconnects such as bond wires or lead frames to integrate different components: chip, substrate and terminals. Inter...
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Robert Lorenz, Patrick Schneider, Jonathan Hoffman | P120254US01
Technology
Making Large-Scale Nanopatterned Arrays by Streamlined Roll-to-Roll Printing
Promising advances in areas like solar cells and photonic crystals are utilizing optical components with nanoscale dimensions. Unique in their ability to collect and manipulate light, these structures...
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Kevin Turner, David Grierson | P120088US01
Technology
Low-Noise, Phase-Insensitive Linear Amplification at Microwave Frequencies
Rapid development of superconducting quantum electronics has motivated a search for quantum-limited amplifiers for the low-noise readout of qubits and linear cavity resonators. Conventional approaches...
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Robert McDermott, David Hover, Guihem Ribeill, Yung-Fu Chen | P120028US01
Technology
Improved Method for Forming Nanoscale Structures Using Solvent Annealing of Block Copolymers
Devices in fields including electronics, photonics and biological engineering utilize 2-D and 3-D nanostructures. Traditional patterning methods such as photolithography and electron beam lithography ...
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Paul Nealey, Lei Wan | P110192US02
Technology
Improved Method for Making Thin Layers of Crystalline Materials
Semiconductors are used in the manufacture of many electronic and optoelectronic devices. In particular, compound semiconductors represent a large class of materials with composition ranges that can, ...
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Max Lagally, Boy Tanto, Deborah Paskiewicz | P110305US01
Technology
Low-Temperature Method for Smoothing the Disordered Edges of Graphene
Graphene possesses tremendous electrical properties, making it suitable for numerous applications. The current method of fabricating this material involves growing or isolating a full sheet of graphen...
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Michael Arnold, Padma Gopalan, Nathaniel Safron, Myungwoong Kim | P110246US01
Technology
Method to Manage Active Leakage Power in Power Gated Integrated Circuits
Managing power consumption of integrated circuits such as microprocessors is important for conserving energy, improving battery life and reducing issues with device cooling. A common method to reduce ...
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Nam Sung Kim | P110120US01
Technology
Synthesis of Low-Cost, High-Density DNA Microarrays
A DNA microarray is a collection of microscopic DNA spots arranged on a solid surface via covalent attachment to a chemically suitable substrate. DNA microarrays allow hundreds of thousands of DNA seq...
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Franco Cerrina, Omar Negrete | P08067US
Technology
High-Frequency Bridge Suspended Diode for Power Generation from High Frequency Microwave Sources
Diodes are two-terminal electrical devices that only allow electrical current to flow in one direction. Diodes are used often in electrical circuits to extract a direct current from an alternating cur...
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Robert Blick, Chulki Kim, Jonghoo Park | P100160US01
Technology
Thin Metal Oxide Films for Transparent and Flexible Electronics
Silicon is a major component in semiconductors due to its good electrical properties, reasonable cost and manufacturability. Zinc oxide is promising as a semiconductive material because it has a large...
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Xudong Wang, Zhenqiang Ma, Fei Wang, Jung-Hun Seo | P100129US01
Technology
Flexible Germanium Lateral PIN Diodes and 3-D Arrays for Photodetector Applications
Flexible single-crystalline semiconductors used in high-performance micro- and macro-electronics have been intensely studied in recent years. Thin-film transistors using single crystalline silicon, ...
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Zhenqiang Ma, Max Lagally, Hao-Chih Yuan | P09168US
Technology
Metal Silicide Nanowires and Methods for Their Production
As electronic gadgets continue to get smaller, tiny metal silicide nanowires may one day be used as fundamental building blocks in devices from cell phones to lasers. Metal silicides already are int...
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Song Jin, Andrew Schmitt, Yipu Song | P06215US
Technology
Nanoelectromechanical Switch in Co-Planar Waveguide
Microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) have been used to create mechanical resonators for switching, filtering and other purposes in electrical systems. NEMS/ME...
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Robert Blick, Hua Qin, Hyun-Seok Kim | P07084US
Technology
Fabrication of Magnetic Tunnel Junctions with Epitaxial Ferromagnetic Layers
Tunneling magneto-resistive (TMR) read heads are the next generation in magneto-resistive readers for hard drive disks. TMRs typically include a magnetic tunnel junction (MTJ) that is composed of an o...
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Y. Austin Chang, Jianhua Yang | P05049US
Technology
Strain-Engineered Ferroelectric Thin Films
Significant efforts are currently underway to create ferroelectric memory (FeRAM) devices from the materials Pb(Zr,Ti)O3 and SrBi2Ta2O9. The main disadvantages of these materials are the volatility of...
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Chang-Beom Eom, Kyoung-Jin Choi, Darrell Schlom, Long-Qing Chen | P05036US
Technology
Organoelement Resists for EUV Lithography
Extreme ultraviolet (EUV) lithography is one of the most promising techniques for creating semiconductor devices, integrated circuits and microelectronic devices with nanoscale features (i.e., smaller...
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Paul Nealey, Franco Cerrina, Lin Zhu, Junyan Dai, Christopher Ober | P04335US
Technology
Efficient Statistical Timing Analysis of Circuits
For integrated circuits, including very large scale integration (VLSI) circuits, to work properly, the signals traveling along the gates and interconnects must be properly timed. Using classical case ...
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Lizheng Zhang, Chung-Ping Chen, Yu Hen Hu | P04377US
Technology
Determining Film Stress from Substrate Shape Using Finite Element Procedures
The fabrication of semiconductor devices involves growing thin films on wafers and patterning them. However, thin films typically exhibit intrinsic stress, which can lead to failure of electronic devi...
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Edward Lovell, Roxann Engelstad, Zhaohua Feng | P03143US