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137 Results for 'Semiconductors & Integrated Circuits'
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Technology
Methods and Compositions for Forming Aperiodic Patterned Copolymer Films
As the development of nanoscale devices increases, the need for materials and methods that can duplicate nanoscale patterns over large areas is growing. Block copolymer materials are useful in nanofab...
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Paul Nealey, Sang Ouk Kim, Erik Edwards, Mark Stoykovich, Juan DePablo | P05119US
Technology
Fabrication of Oxide Barriers Using Selective Oxidation of Metallic Thin Films
Tunneling magneto-resistive (TMR) read heads are the next generation in magneto-resistive readers for hard drive disks. TMRs typically include a magnetic tunnel junction that is composed of an oxidize...
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Y. Austin Chang, Jianhua Yang, Peter Ladwig | P04250US
Technology
Materials and Methods for Creating Nanoscale Patterned Features with Atomically Smooth Surfaces
Production of faster, more powerful microelectronics requires that device features continue to shrink in size. Current lithographic processes based on chemically amplified resists routinely pattern fe...
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Paul Nealey, Erik Edwards, Juan DePablo, Tushar Jain | P05233US
Technology
PIN Diodes for Fast Photodetection, and High-Speed, High-Resolution Imaging and Sensing
PIN diodes are semiconductor devices that include an undoped intrinsic semiconductor region between the p-type and n-type regions. These diodes are commonly integrated as photodetectors on silicon CMO...
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Max Lagally, Zhenqiang Ma | P04389US
Technology
Progressive Random Access Scan Circuitry
Very large scale integrated (VLSI) circuits are tested before use to evaluate reliability and performance. The two most common testing methods are serial-scan and random access scan (RAS). The serial...
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Kewal Saluja, Dong Hyun Baik | P06048US
Technology
Directed Assembly of Triblock Copolymers
The current art of nanoscale manufacturing uses self-assembling diblock copolymers to replicate a chemical pattern upwards. This method may be used to replicate a chemical pattern over a large area. H...
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Paul Nealey, Juan DePablo, Frank Bates | P06113US
Technology
Method for Improving Plasma Processes by Controlling a Voltage Waveform
The semiconductor industry fabricates integrated circuits (IC) through a series of plasma processes that involve etching lines and spots, as well as depositing thin films of materials and modifying su...
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Amy Wendt | P06468US
Technology
Multilayer Si/SiO2 Semiconductors for Photoelectric Device Fabrication
Computer chips, composed of silicon (Si) semiconductors, store and transmit information as electrons. The negative charge on electrons, however, hinders the speed with which information can be trans...
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Mark Eriksson, Max Lagally, Arnold Kiefer | P06013US
Technology
Method for Fabricating High-Speed Thin-Film Transistors
Thin-film transistors often use a single-crystal layer of silicon semiconductor attached to a flexible plastic substrate to allow flexibility in the electronics. However, transistors using some types ...
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Zhenqiang Ma, Hao-Chih Yuan, Guogong Wang | P06456US
Technology
Silicon Nanomembrane Thermoelectric Materials and Devices
Thermoelectric materials can turn heat into electrical power or remove heat by applying a voltage. They are used in many applications, ranging from a simple, electrically cooled ice chest, to high-tec...
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Max Lagally, Paul Evans, Clark Ritz | P06453US
Technology
Nano-Mechanical Computer Based on Nano-Electro-Mechanical Transistors
Conventional integrated circuits, such as complementary metal-oxide-semiconductor (CMOS) circuits, allow large numbers of transistors to be combined into electronic gates. These gates control the flow...
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Robert Blick, Robert Marsland | P07203US
Technology
Thin-Film Semiconductor for Increasing Microprocessor Speeds
Complementary metal-oxide semiconductor (CMOS) technology is commonly used in integrated circuits for microelectronics. Current is produced in semiconductor devices by using mobile charge carriers, ei...
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Max Lagally, Shelley Scott, Donald Savage | P07485US